22 March 2013

Noesis Technologies Announces ComLab™ Platform, a New Paradigm Towards Communication Systems Hardware Emulation

Noesis Technologies announced today the immediate availability of ComLab™, a cost efficient highly integrated development environment (IDE) that enables a system designer to rapidly build, configure and evaluate in real-time the performance of complex telecommunication systems. It is comprised of a Xilinx FPGA based board for the real-time HW emulation, a sophisticated application SW with interactive GUI capabilities for configuration, control and monitoring purposes as well as a rich portfolio of highly optimized telecom subsystem silicon IPs. ComLab™ platform is ideal for proof-of-concept rapid prototyping as well as an intuitive educational tool for engineers.


ComLab™ platform can be used in a variety of applications, including:

  • Fast and efficient modeling and development of complex telecom systems.
  • Proof-of-concept rapid prototyping.
  • In-circuit emulation.
  • R&D telecom engineers training.
  • Educational tool for universities.
  • Low-volume production.

For more information please download ComLab™ platform product brief at http://www.noesis-tech.com/files/ntCOMLAB_pb.pdf

About Noesis Technologies L.P.

Noesis Technologies, L.P. is a silicon IP provider specialized in hardware implementation of high computational complexity telecom algorithms. Our hardware accelerator IP solutions allow telecom system developers to significantly off load demanding tasks from the CPU and to drastically decrease execution time thus boosting the overall system performance. Our IP cores present an industry leading combination of high performance, low power and low die-area, as well as easy customization for adaptability to a wide range of applications. Noesis offers a complete portfolio of Forward Error Correction IP core solutions that includes Reed Solomon Codecs, Viterbi Decoders, Turbo Product and Turbo Convolutional Codecs, BCH codecs, (De)Interleavers, Channel Emulators. The company additionally offers a range of cores in the areas of security, networking, audio/voice compression and telecom DSP. Our solutions have been integrated in our customers' end-products in telecom, aerospace and defense systems. Noesis Technologies is headquartered at Patras Science Park, GR 26504 Patras, Greece and has offices at San Jose, CA 95134, USA.

For more information:
Contact: George Krikis, Managing Director
Tel: +30 2610 9115311, Email: gkrikis@noesis-tech.com

12 February 2013

Tensilica, Inc. and Irida Labs today announced that they are partnering to enable availability of Irida Labs’ computer vision software portfolio on Tensilica’s new IVP imaging/video DSP (digital signal processor). Irida Labs has joined Tensilica’s Xtensions partner program and will enhance the support of new joint customers with their extensive computer vision expertise.

“We were very impressed with the embedded vision expertise at Irida Labs, and we welcome them to our partner program,” stated Gary Brown, Tensilica’s director of imaging/video. “We see many opportunities for their applications at companies interested in offloading the imaging functions to our efficient DSP to get 10 to 20x higher peak performance at lower power.”

“We are excited to partner with Tensilica to offer our embedded vision technology and software solutions on a platform as powerful as the IVP,” said Vassilis Tsagaris, CEO of Irida Labs.  “Together, we are able to deliver high-performance power-efficient video analytics and computer vision solutions to the market. We also see great potential for our other software solutions. The IVP platform has proven to be ideal for realizing a cost-effective implementation.”

IVP is an imaging and video dataplane processor (DPU) that is ideal for the complex image, video and gesture recognition signal processing functions in mobile handsets, tablets, digital televisions (DTV), automotive, video games and computer vision. The IVP DSP has a unique instruction set tuned for imaging and video pixel processing that gives it an instruction throughput of over 16x the number of 16-bit pixel operations compared to that of the typical host CPU with single-issue vector instructions.  In addition to its raw instruction throughput advantage to host CPUs, the imaging specific compound instructions supported by IVP give it a higher peak performance of 10 to 20x and much higher energy efficiency.  IVP’s rich instruction set has more than 300 imaging, video and vision-oriented vector operations, each of which applies to 32 or more 16-bit pixels per cycle.

About Irida Labs

IRIDA Labs is a platform-independent leading technology provider of software and silicon intellectual property (IP) for embedded computer vision. Our product portfolio includes embedded vision software and silicon IP for high throughput applications such as video stabilization, face detection and recognition, low-light image enhancement, pedestrian detection and traffic sign recognition addressing consumer electronics, mobile devices and automotive markets. Founded in late 2007, the engineering team is based in Greece, with worldwide sales support. Please come see our demo in Tensilica’s booth 6-D101 at MWC2013 and visit us online at www.iridalabs.com.

About Tensilica

Tensilica, Inc. is the leader in dataplane processor IP cores, with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.

Tensilica is a registered trademark belonging to Tensilica, Inc. Xtensions is a trademark of Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

3 January 2013

Advent Technologies Inc. brings innovative fuel cell technologies to state

Connecticut Innovations (CI), the state’s quasi-public authority responsible for growing Connecticut businesses through innovative financing and strategic assistance, today announced that it has made a $1 million investment in Advent Technologies Inc. (Advent) of East Hartford, Conn., the parent company of Advent Technologies S.A., through its Eli Whitney Fund. This investment, part of a $2.3 million funding round also involving Piraeus Capital Management, Systems Sunlight, Velti and individual investors, spurred Advent Technologies S.A. of Athens, Greece, to relocate its headquarters to Connecticut, while maintaining R&D operations overseas.

“Advent is a wonderful addition to Connecticut’s growing fuel cell community, a sector that Governor Malloy is eager to strengthen through strategic investments such as this one,” said Claire Leonardi, chief executive officer and executive director of CI. “The company brings innovative technology to Connecticut, and we look forward to providing strategic guidance and introductions as it establishes itself here.”

Advent develops and produces materials, components and systems for renewable energy applications. Its current focus is the development and production of high temperature proton exchange membranes (HT PEMs), high temperature membrane electrode assemblies (HT MEAs) and other HT PEM fuel cell products and systems. Its products are designed for use in electricity generation and hydrogen cleanup. In addition to conducting R&D in Greece, Advent will establish R&D and manufacturing operations in Connecticut.

Many of Advent’s products incorporate the company’s proprietary high temperature proton exchange membrane, known as Advent TPS®, which uses a unique pyridine-based polymer electrolyte. Advent TPS® HT PEM is used as a building block for the company’s HT MEAs and fuel cell stacks and gives Advent’s products superior properties. Advent’s HT PEMs operate in a temperature range that enables their use with traditional fuels such as natural gas, propane, biofuels and military fuels.

“We are very excited about the completion of our recent financial round led by Connecticut Innovations, which has allowed us to commercialize our technology and relocate our headquarters to the U.S.,” said Advent Chief Executive Officer Vasilis Gregoriou, Ph.D. “The concentration of a large amount of talent related to the fuel cell industry in Connecticut and the outstanding track record of Connecticut Innovations in supporting the growth of technology companies made it easy for us to decide to move our headquarters to East Hartford while maintaining an R&D presence in Greece.”

The current and potential applications for Advent’s components and HT PEM fuel cells are diverse and include combined heat and power applications for residential and small business use, anti-idling applications (e.g., in powering truck radios and charging phones in trucks when drivers park their vehicles) and military applications (e.g., in charging and powering portable electronic devices, such as radios, computers and night-vision goggles).

HT PEM fuel cells demonstrate clear advantages – in size, weight, performance, and cost – over their low temperature counterparts. For these reasons, and because they are powered by more traditional fuels, HT PEM fuel cells are much more practical than low temperature PEM fuel cells.

Russell Tweeddale, CI managing director of investments, represents CI on Advent’s board of directors.

About Connecticut Innovations Inc.

Connecticut Innovations (CI) is a quasi-public corporation providing equity, debt and bond financing and other forms of financial assistance to companies in all stages of the business life cycle, from startup to later stage. CI offers its portfolio companies strategic guidance and collaborations with partners in business, finance, education, government and nonprofit sectors. CI’s initiatives are designed to grow the state’s economic and technology base, and to stimulate business investments and job creation. For more information on CI, please visit www.ctinnovations.com

About Advent Technologies Inc.

Advent Technologies Inc. is the parent company of Advent Technologies S.A., a six-year-old 
Technology Company based in Greece. Advent develops new materials and systems for renewable energy technologies and is primarily focused on high temperature PEM fuel cell membranes and components. The company was founded by researchers from the Foundation for Research & Technology – Hellas and the University of Patras, both internationally recognized research centers. For more information, visit www.advent-energy.com.

15 November 2012

Think Silicon Ltd, today announced that Dialog Semiconductor uses ThinkVG, a Graphics Processing Unit  to get Graphics power in it's new series of products. ThinkVG is integrated in the recently announced  Green VoIP™ “SC14453” multicore system-on-chip  (SoC)  along  with  ThinkLCD  Display  Processor  that  enables  rendering  of  fluid graphic user interfaces onto touchscreen LCD displays.

ThinkVG is the smallest Graphics Processing Unit (GPU) in the market supporting the Khronos Group OpenVG 1.1 standard. It is an extremely low-gate count IP Core based on VShader, a C/C++ programmable  Floating  Point  SIMD  Streaming  processor,  designed  for  graphics  applications. System Architecture  is  Scalable  and  embedded  software  allows  flexibility.  ThinkVG  comes complete with  Software  Library  implementing OpenVG  1.1  running  on  VShader  and  with  API package running on host processor with emphasis on minimizing CPU overhead by the use of command lists and on reducing memory bandwidth by utilizing custom image compression hardware.

“ThinkVG is developed to support OpenVG having in mind to provide a very compact and low power solution for embedded devices that require fast 2.5D Graphics Rendering” said George Sidiropoulos, Managing Director of Think Silicon. “We focused on designing Unified Shading Architecture assisted by a balanced pipeline that would achieve the highest throughput per gate ratio due to high component reusability   and at the same time offer scalability for different standards and performance levels in the future.”

René Kohlmann, Senior Director for Dialog’s Low Energy Wireless and VoIP Business Development, comments: “In close cooperation with Think Silicon, Dialog successfully integrated the ThinkVG graphical process unit in its latest high end VoIP processor the SC14453.”

ThinkVG is available today and can be complemented with ThinkLCD/ML, a multilayer Display controller and Think2D/MJPEG, a 2D Composition Engine with optional built-in MJPEG decoder features.

The Project “Vector graphics accelerator - ThinkVG” is co-financed by Hellenic Funds and the European Regional Development Fund (ERDF) under the Hellenic National Strategic Reference Framework (NSRF) 2007-2013. The Project is carried out in the framework of the O.P. “Competitiveness-Entrepreneurship” within the Programme “Hellenic Technology Clusters in Microelectronics – Phase-2 Aid Measure”. The Programme, managed by the Intermediate Body “Corallia - Hellenic Technology Clusters Initiative”, aims to achieve a long-term competitive advantage, to materialize a viable ecosystem of excellence and develop a sustainable innovation cluster in the area of Semiconductors, Νano/Μicroelectronics and Embedded Systems.